Thermal analysis for high density computing

Thermal analysis for high density computing is designed to help you identify, address and resolve heat-related issues in your computing environment.

Thermal analysis for high density computing is designed to help you identify, address and resolve heat-related issues in your computing environment. Our methodology includes two distinct processes: one allows you to develop thermal solutions for current data centers; the other helps you plan and optimise new data center facilities.

Through analysis of real-time thermal models, we can pinpoint real and potentially unsuitable high-heat areas within a computer room-and create solutions that can help you alleviate the problem. In addition to helping to reduce operating costs by optimising heat flow and reducing the need for cooling, this thermal analysis can help you increase system resilience, business continuity and productivity.

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